Latest Tender Detail from indian space research organisation ISRO for the tender for data acquisition system- bridge amplifier make- hbk model 1- mx1615 , interface card -can bus with modbus gateway module make- hbk model 1- mx471c , interface- communicator can ethernet modbus tcp-2 port make- hbk model ab7319-b , linear strain gauge make- hbk model 1-ly41- 6 by 350v3 , self-adhesive rtd surface mountable temperature compensation sensor make- hbk model 1-tt-3 by 100, spares for daq for overcurvature system, data acquisition system- bridge amplifier make- hbk model number 1- mx1615, interface card -can bus with modbus gateway module make -hbk model 1- mx471c, interface- communicator can ethernet modbus tcp-2 port model ab7319-b, strain guage- linear strain gauge make - hbk model 1-ly41- 6 by 350v3 each packet contains 10 no., temperature sensor- self-adhesive rtd surface mountable temperature compensation sensor make- hbk model 1-tt-3 by 100 each packet contains 10 no. in thiruvananthapuram, kerala,. Reference number 16138728. Don't miss out on this chance to be part of a significant project. Register for free today to access the complete tender details and download the necessary documents. Seize the opportunity with Tender 18!
| T18 Ref No: | 16138728 |
|---|---|
| Tender ID: | GEM/2026/B/7723831 |
| Tender Agency: | indian space research organisation ISRO |
| City: | thiruvananthapuram |
| State: | kerala |
| Tender Related Keywords : | |
| Description : | total quantity = 7 ----- document required from seller = oem authorization certificate,additional doc 1 (requested in atc),compliance of boq specification and supporting document ----- evaluation method = total value wise evaluation |
| T18 Ref No: | 16138728 | Tender Value: | Refer Document |
|---|---|---|---|
| Tender ID: | GEM/2026/B/7723831 | Tender EMD: | Refer Document |
| Tender Agency: | indian space research organisation ISRO | Tender Fee: | Refer Document |
| City: | thiruvananthapuram | Published Date: | Jul 07, 2026 |
| State: | kerala | Due Date: | Jul 30, 2026 |
| Tender Related Keywords : | data acquisition system, temperature sensor, data acquisition, interface card, modbus gateway, strain gauge | Tender Opening Date: | Jul 30, 2026 |
| Description : | total quantity = 7 ----- document required from seller = oem authorization certificate,additional doc 1 (requested in atc),compliance of boq specification and supporting document ----- evaluation method = total value wise evaluation | ||
Looking For Complete Tender Bidding Consultancy? Our Technical Experts Will Help You Prepare And Submit Your Tender Successfully.